|
|
|
Chipidea's USB 2.0 OTG High Speed IP Core Silicon Proven on UMC's 0.13um Technology
Core is based on the new USB On-The-Go standard for portable
consumer devices and is ready for design-in at UMC
MAIA, Portugal and HSINCHU, Taiwan—(BUSINESS WIRE)—April 20, 2004—
Chipidea Microelectronica, SA (Chipidea), an analog and
mixed-signal semiconductor IP provider and world leader in high speed
USB2.0 On-The-Go (OTG), and UMC (NYSE:UMC), a world leading
semiconductor foundry, today announced that Chipidea's CI12323ul USB
High Speed OTG Physical Interface (PHY) IP core has achieved silicon
verified "Silver" status in UMC's Gold IP program for 0.13um process
technologies and is ready for design-in. The core targets customers
designing chips for portable applications such as mobile phones and
PDAs, allowing these devices to directly connect with each other.
"Targeting the new CI12323ul USB OTG core to UMC's 0.13um process
technology demonstrates Chipidea's commitment toward developing IP
cores for wide distribution, and is a natural step that will give our
customers a competitive edge in terms of area and performance," said
Milton Sousa, business development manager of Chipidea's IP
Connectivity Solutions Business Line. "Prior to this latest effort, we
have achieved high-speed certification of our USB OTG High Speed core
(CI12295ug) on UMC's 0.18um process. This IP was further used to
develop an Integrated Circuit (IC) with a USB Low Pin Interface
(ULPI) -- samples from Chipidea are slated for availability in July."
The CI12323ul is a USB OTG High Speed PHY IP that supports UTMI+
and can be used in host, device or dual-role applications. The
deliverables package of the CI12323ul includes all backend views
(GDSII, place and route abstracts and timing information), as well as
a simulation model with a quick start testbench and extensive
documentation covering the specification, testability, assembly and
production guidelines and a detailed silicon characterization report.
With a total core area of 0.9mm(squared) and max current consumption
in high speed transmit mode of 47mA, this IP provides a cost-effective
solution with high performance and high-power efficiency, key elements
for portable applications.
Ken Liou, director of the Design Support Division at UMC, stated,
"UMC understands and continues to address the needs of our customers
designing for the portable consumer market. Designers of analog &
mixed signal chips using UMC's proven, mainstream 0.13um technology
platform will welcome the availability of Chipidea's USB 2.0 IP core
through our Gold IP program. We value our IP partnership with
Chipidea, and look forward to continuing our productive relationship."
About USB On-The-Go
USB OTG (On-The-Go), (announced in February 2004, see
http://www.chipidea.com/website_45c/index.html), is a supplement to
the USB 2.0 specification, brings the additional feature of allowing
portable devices to act as a limited host and exchange data directly
with each other without requiring a PC to act as the host. It is
estimated that more than 1.4 billion products are designed with USB
ports, making USB the predominant I/O connectivity standard in the
market. USB On-The-Go (OTG) enhances the USB specification by allowing
point-to-point communication between devices. As devices like mobile
phones and PDAs gain in popularity and intelligence, the requirement
for a direct connection to each other is also growing. The answer to
this requirement is the standard called USB On-The-Go. For more
information on the USB2.0 OTG core and other products of Chipidea
please consult the web site at www.chipidea.com.
About Chipidea Microelectronica, SA
Chipidea is a leading semiconductor IP Company headquartered in
Portugal providing solutions for complex connectivity, analog,
mixed-signal and digital signal processing applications. Chipidea
works together with all major open foundries as well as captive fabs
from global semiconductor firms. Its broad portfolio ranges from AD/DA
converters to Codecs, Power and Clock Management, AFEs for digital
media and communications, wireless transceivers and USB physical
interfaces. Chipidea employs over 160 people worldwide, with plans to
reach 250 in 2006, and has offices in Europe, North America and Asia.
Chipidea can be found on the web at http://www.chipidea.com.
About UMC
UMC (NYSE:UMC)(TSE: 2303) is a leading global semiconductor
foundry that manufactures advanced process ICs for applications
spanning every major sector of the semiconductor industry. UMC
delivers cutting-edge foundry technologies that enable sophisticated
system-on-chip (SOC) designs, including 90nm copper, 0.13um copper,
embedded DRAM, and mixed signal/RFCMOS. UMC is also a leader in 300mm
manufacturing; Fab 12A in Taiwan is currently in volume production for
a variety of customer products, while Singapore-based UMCi has just
entered volume production. UMC employs over 8,500 people worldwide and
has offices in Taiwan, Japan, Singapore, Europe, and the United
States. UMC can be found on the web at http://www.umc.com.
Contact:
UMC
Alex Hinnawi, (886) 2-2700-6999 ext. 6958 (Taiwan)
alex_hinnawi@umc.com
or
KJ Communications (for UMC)
Eileen Elam, 650-917-1488
eileen@kjcompr.com
or
Chipidea
IP Communications:
Yanyan Qiu, +351-210 336 361
yqiu@chipidea.com
or
IP Connectivity Solutions:
Milton Sousa, +351-229 471 010
milton.sousa@chipidea.com
|
|
|
